去除塑料包封层，露出芯片表面，是DPA(破坏性物理分析)及FA(失效分析)的关键一步。
It is a crucial step for destructive physical analysis (DPA) and failure analysis (fa) to remove the plastic package for the die exposing.
通过对电子元器件破坏性物理分析(DPA)试验中遇到的几个难点问题的分析、讨论，强调了在DPA试验中对发现的问题和缺陷进行认真分析和评价的重要性。
This paper discusses several difficult problems in DPA of electronic components, and emphasizes the importance of evaluation and analysis to the problems and defects which were found in DPA.
破坏性技术是将样本溶解于溶剂，然后通过物理方法分析元素浓度的技术。
Destructive techniques are techniques in which the sample is decomposed by a reagent and then the concentration of the element in the aqueous extract determined by a physical technique.
应用推荐