关键词：活性元素；铜一金刚石复合材料；界面结合强度；接触角 [gap=747]Key words：Active element；Cu—diamond composites；Interface bonding strength；Wetting angle
基于8个网页-相关网页
...层;界面结合强度[gap=857]Key words:combustion synthesis-hydrothermal treatment; bioceramic; coating; the binding strength ...
基于6个网页-相关网页
铸态铸件 ... 密容加镁包sealedspheroidizingtreatmentladle 干扰元素interferenceelement 石墨蠕化处理[蠕化处理]vermiculationofgraphite ...
基于1个网页-相关网页
挤压温度过高或过低导致界面结合强度降低。
The bonding strength of the composite interface is reduced when too low or too high extrusion temperatures are employed.
由于碳纳米管与基体的界面结合强度低，使复合材料抗弯强度下降。
Because the low interface strength of carbon nanotube and metal matrix, carbon nanotube do not act as enhancements to bending.
元素在界面两侧的扩散是影响材料显微组织、表观硬度及界面结合强度的关键。
The interfacial diffusion of alloying element is an important factor to microstructure, apparent hardness and interfacial bond strength.
应用推荐