选择航天器和低温工程中常用金属材料铜、不锈钢，用激光光热法原理，研究低温接触界面层热阻。
The thermal contact resistance between copper and stainless steel was investigated at 300 K and 20 K using the photothermal method.
实验得到了铜在常温下的调制频率与相位差间的实验数据，通过对实验数据的线性拟合得到了铜的热扩散系数，以及铜-不锈钢在300 K和20 K低温下的接触界面层热阻。
The experimental data of copper was obtained about the phase lag dependence of modulation frequency at normal temperature, and the thermal diffusivity of copper was acquired by using the linear fit.
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