...业标准在电子组装业中的应用 关键词：电子组装，电子制造，行业标准，表面贴装，焊接 [gap=435]Keywords: Electronics assembly,electronics manufacturing,industry standards,surface mount,soldering ..
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微电子组装 [电子] microelectronic packaging ; Microelectronics assembly technology ; microelectronics assembly
确信电子组装材料部 Cookson Electronics Assembly Materials ; CEAM
电子组装技术 Electronics assembly technology
高密度电子组装 high density electronic packaging
电子组装和封装 Assembly & Package
电子组装件的返工 Rework of Electronic Assemblies
控制电子组装件 control electronics assembly
电子组装展览会 HKPCA & IPC Show
The voice of forbidding use of lead and its compound all over the world is getting more powerful. Therefore, the development of lead-free electronic packaging is becoming a irreversible trend.
近年来伴随着电子工业的发展,所带来的铅污染环境问题也日益突出,世界范围内禁止使用铅及其化合物的呼声也越来越高,发展无铅电子组装已经成为不可逆转的世界范围内的趋势。
参考来源 - PBGA无铅焊点可靠性的有限元模拟与寿命预测·2,447,543篇论文数据，部分数据来源于NoteExpress
电子组装的高密度给传统波峰焊接技术提出了新挑战。
The high density of electronics assembly has already bring up the new challenge to conventional wave soldering technology.
今天，万能工具公司被看作电子组装设备的领先制造商。
Today, Universal Instruments is regarded as a leading manufacturer of electronic assembly equipment.
为此，必须研究采用先进的微电子组装技术取代落后的常规电子组装技术。
So it is necessary to research and develope the advanced microelectronic packaging to replace the conventional electronic packaging.
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