两方法可为筛选光电子器件封装提供依据，并为优化封装的设计提供参考。
The two methods are useful for screening and optimizing the packaging of high-speed optoelectronics devices.
本文采用理论、数值模拟、实验等方法系统的研究了MEMS和光电子器件气密封装工艺中的关键技术问题。
This dissertation conduct fundamental research into several key issues of hermetic MEMS and optoelectronic devices by integrating theory, numerical simulation, and experiments.
所述为可用于电子器件的封装组件，所述电子器件具有基片和电有源区，所 述封装组件包括阻挡片；
Describe are encapsulation assemblies useful for electronic device, having a substrate and an electrically active area, the encapsulation assembly comprising a barrier sheet;
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