用硅烷对B-1E型玻璃封接的电子器件管座表面进行了处理改性，大大提高了玻璃表面的电气绝缘性能。
A surface modification has been made by silane for the electronic device base sealed by B-1E glass. The electric insulation performance of the glass surface is well improved.
研究了玻璃粉／环氧树脂封接复合材料的制备与性能。
The preparation and properties of superfine glass powder/epoxy resin composites were studied.
对封接金属的表面处理工艺进行了研究，特别是封接金属上的封接玻璃的配方及玻璃厚度进行了研究。
The surface treatment of the sealing metal is researched, especially the dispensation of sealing glass on the metal and the thickness of the sealing glass.
应用推荐