当有裂缝存在时，湿度扩散的范围更深、更广，相应的湿度应力则会更大，不利于裂缝的预防与控制。
The humidity would diffuse a large scope as there are cracks in the cement-based composite, resulting in the increase of shrinkage stress which is not benefit for crack control.
它表明没有覆盖硅氮化层的严重驼峰取决于经过LPCVD的内部涂层氧化沉淀后化学处理期间的湿度扩散。
It shows severe hump without capping silicon nitride layer due to moisture diffusion during thermal anneal after inter layer oxide deposition by LPCVD.
随着介质温度的升高，湿度的降低，横向水分扩散系数增大。
Moisture diffusion coefficients across grain direction increase with medium temperature increasing and humidity decreasing.
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