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介绍了覆盖件板料冲压成形过程有限元模拟技术的一般方法、常用软件及其最新进展和发展趋势。
The paper introduces finite element simulation technology for cover panel stamping forming process, including applied method and software, as well as current status and development trend.
以W77E58和MAX3100芯片为例，首先介绍了一种利用单片机I/O接口软件模拟串行外设接口（SPI）的方法。
Taking W77E58 and MAX3100 as example, the paper introduces a method of using I/O interface of singlechip to simulate Serial Peripheral Interface (SPI) at first.
介绍了一步成形法模拟软件的应用领域、基本原理和方法以及同增量法模拟比较的优点。
The application fields, basic principle and FEM of one step forming simulation software and its advantages compared with incremental method simulation have been introduced.
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