木材干燥应力是干燥过程中产生干燥缺陷的主要因素。
The drying stress is the main reason that causes the drying defects.
当试材含水率降至FSP以下时，微波处理可以有效地减小木材内部的含水率偏差，从而减缓木材干燥应力。
Otherwise the moisture content gradient and drying stress can be reduced by MW treatment when moisture content is below FSP.
在模型中引入与木材含水率密切相关的干缩元件，解释各层的干缩差异是产生干燥应力的源动力。
Wood drying shrinkage element introduced in the model may explain the original force of producing drying stress of shrinkage differential of different layers.
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