流通空间被最小化，在外部视线上与轴线整合。
Circulation Spaces were minimised and were all arranged with external views on axis.
该传感器将集成大量霍尔元件技术和进行信号调理的仪表电路整合在一起，从而使与硅霍尔元件特性相关的温度漂移降到最小。
The sensor combines integrated bulk hall cell technology and instrumentation circuitry to minimize temperature related drifts associated with silicon hall cell characteristics.
方法：在设计上，选用合适的材质，将饭盒体积最小化并进行功能整合。
Methods it is designed by selecting the suitable material and integrating the minimal volume with function.
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