在所有半固态镁合金试验中，水淬试样的晶粒密度都大于重力铸造的金属型试样的晶粒密度。这表明在半固态成型过程中，晶粒有很强的长大合并的趋势。
The density of the quenchinching samples was higher than that of the metal-mould ones and the grains were much easier to grow and merge in the shaping of the semi-solid alloys.
随着电流密度的增加﹐阴极极化作用随着增加﹐镀层晶粒越来越细。
Along with the increase of the current density, cathode polarization effect, coating grain with increasing more and fine.
结果表明，随着电流密度的增加，电沉积的锡晶粒度逐渐细化，合金层的晶粒度有变粗的趋势。
The results show that the grain size of tin gradually gets smaller while that of alloy layer gets bigger and bigger with the increasing of current density.
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