...可焊性镀层及其在电子工业中的应用 关键词：电镀；无铅锡合金；可焊性 [gap=528]Key words:Electroplating; Lead-free tin alloy; Solderability Document Code:A Article ID:1001-3474(2000)03-0098-03 ..
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主要产品有：焊锡丝、焊锡条、无铅锡线、无铅锡条、锡膏、锡锭、助焊剂、电镀阳极棒、巴氏合金等。
The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.
随着电子产品制造寻求使电子互连无铅很多人都在找纯锡焊和涂层作为一个经济的替代传统的锡铅合金。
As electronics manufacture seek to make electronic interconnectio lead-free, many are looking at pure tin soldering and coating as an economical alternative to traditional tin-lead alloys.
本发明公开了一种无铅无卤素锡焊膏，包括以下重量份组分：合金粉 80-98，助焊剂2-20；
The invention discloses a leadless and no-halogen tonal, comprising following components with percent by weight: alloy powder 80-98 and welding flux 2-20;
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