在电子封装中焊料是主要的连接材料，现在无铅焊料已经普及并大规模应用在实际电子产品中。
Solders are the main join materials in the electronic - packaging and now lead-free solders are used in the electrical products on a large scale.
在熔融状态下无铅焊料合金的行为是影响电子产品微连接钎焊性的关键因素。
The solderability of electronic solders and some factors that influence the solderability are discussed.
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