...网 较成熟外,其它许多方法也已经实用化,如立体光刻 (Solid Ground Curing,SGC);数码累计成型(Digital Brick Laying,DBL);三维 焊接(ThreeDimensional Welding,TDW);弹道微粒制造(Ballis...
基于2个网页-相关网页
...豆丁网 较成熟外,其它许多方法也已经实用化,如立体光刻 (Solid Ground Curing,SGC);数码累计成型(Digital Brick Laying,DBL);三维 焊接(ThreeDimensional Welding,TDW);弹道微粒制造(Ballis...
基于2个网页-相关网页
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