介绍了旋转载体用硅微机械陀螺敏感元件的结构和利用双面多次光刻、腐蚀等微机械工艺加工得到硅振动单元的工艺过程。
Using MEMS technics to process the silicon vibration element, in the process two side lithography and etching has being used many times.
采用液压振动装置来代替四轮偏心式机械振动装置，建立结晶器重量及振动单元模型，应用ANSYS 对系统的模态分析及瞬态分析计算。
Creating the model on weight and vibration unit of the mould and using the commercial software ANSYS, modal and transient of vibratory system were analyzed and calculated.
对此系统的超声振动单元结构及原理进行了分析，阐明了应用中的关键技术点——频率选择，并通过实验验证了超声振动对于减小细胞在切剖中的变形和损伤是非常有效的。
It introduces the structure and principle of the ultrasonic vibration unit, analyzes how to choose the work frequency, and proves that it is valid and feasible by cow ovum cutting experiment.
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