如传统配方，即80 - 75%磷酸(体积比)，硫酸20 - 25%，则抛光出来的光亮度不足。

If traditional formula, namely 80-75% phosphoric acid (volume compared to), sulfuric acid 20-25%, then polishes the radiance is insufficient.

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若未能有效地监测抛光运作，便无法避免硅片产生抛光过度或不足的缺陷。

The most obviously of all, it needs oneefficient endpoint detection system to monitor CMP operation to avoid polishing over or not polishing completely.

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