半导体制程技术包括氧化、扩散、热处理、合金化、再流动制程、铜制程及化学机械研磨制程简介。
Introduction to semiconductor manufacturing technology including oxidation, diffusion, alloying, re-flow process, copper process and chemical-mechanical polishing.
提出了采用机械合金化制粉，进而进行爆炸烧结和后续热扩散处理的制取铜铬合金的方法，并初步进行了实验研究。
The method making powder by mechanical alloying is brought forward. Getting CuCr alloy by explosive sintering and thermal diffusion disposal are studied some primary experiments were done.
基于微观相场动力学理论建立的微扩散方程，以原子占位几率和序参数描述合金沉淀过程的原子簇聚和有序化。
The nucleation of ordered phase is simulated by microscopic diffusion equation and the assumption of classical nucleation theory is examined.
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