采用感应耦合等离子体刻蚀技术实现了不同形状和几何参数的规则织构化硅片表面的构筑与制备。
Regular textured silicon surfaces with various shape and different geometrical parameters were successfully designed and prepared using inductively coupled plasma (ICP) etching technology.
利用电子束光刻、等离子体增强化学气相沉积、感应耦合等离子体刻蚀来实现跑道型微环谐振器的制备；
The optical part can be done by applying Electron Beam Lithography (EBL), Inductively Coupled Plasma (ICP) etching, and Plasma-enhanced Chemical Vapor Deposition (PECVD).
原子谱线和离子谱线特性分析表明，在鞘层附近区域感应耦合等离子体具有较高的离子密度和较低的电子温度。
It was shown that the ion density is higher and the electron temperature is lower in the vicinity of inductively coupled plasma sheath according to the ionic line and atomic line.
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