这就是我为什么喜欢尽可能多地将核心函数放入模块的模式，而将脚本只作为这些模块的小型封装器的多个原因之一。
That is one of the many reasons why I prefer the paradigm of placing as much core function into modules as possible, and having scripts be little more than small wrappers around these modules.
小型封装和纤薄的外形使该器件非常适合于印刷电路板区域和元件净空具有非常重要作用的应用。
The small package outline and low profile make this device ideally suited for use in applications where printed circuit board area and component headroom are at a premium.
将传感器与信号调节电路利用厚膜电路工艺进行混合封装，完成了传感器的一体化，实现了传感器的小型化。
Sensor and signal regulating circuit is carried out through hybrid packaging by making use of thick-film circuit technology, which realizes integration and minimization of sensor.
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