对于采用激光钻微通孔的情形,内层可以具有最小的环线,它有时候被称之为定位焊盘(Capture Pad)或者反弹焊盘(Bounce Pad),它可以起到提高激光钻孔精度的作用,具有登记记录激光钻孔到N-1层面上和N-1层的图像允许定位误差的能...
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介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。
This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital image Processing and Pattern Recognition.
表面贴装印制板设计直接影响焊接质量,将专门针对表面贴装印制板的焊盘设计、布线设计、定位设计、过孔处理等实用技术作一些探讨。
Design of surface mount PCB makes an impact on soldering quality. The design of soldering pad, track layout, location and through hole treatment are discussed.
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