主要研究了环氧胶接接头在不同温度水中的老化行为，并用扫描电镜（SEM）和傅立叶红外光谱仪（ FTIR）分析了其失效的机理。
The effect of temperature on the aging performance of epoxy bonded joint in water was researched, and its failure mechanism was analyzed by SEM and FTIR.
分析了这些特殊失效现象及失效机理，提出可能采用的筛选方法。
Finally by analysing the special failure phenomenon and mechanism of capacitors, some available screening methods are proposed.
失效分析是验证测试的重要方面，它为探求芯片失效机理与优化验证测试流程奠定了基础。
Failure analysis is a main aspect of the validation test and it provides the fundamental ways for tracing the failure mechanisms and optimizing the validation test flow.
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