采用多普勒激光振动测量系统，获得了热超声倒装键合过程中工具末端及芯片的振动速度曲线。
With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.
建立了用来检测微机电系统谐振器面内运动的激光差动多普勒系统，测量了谐振器的振动速度。
A differential laser Doppler system is built to measure the in-plane movement of micro-electro-mechanical systems (MEMS), and the vibration of a MEMS resonator has been measured.
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