《林产工业》杂志社 关键词：UMF树脂胶；E0级胶合板；固化剂体系 [gap=1095]Key words：UMF resin adhesive;E0 grade plywood;Curing agent system
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本文着重从银粉的粒度、添加量和固化剂的种类、用量以及固化条件等方面研究和探讨了环氧-低分子聚酰胺-银粉导电胶体系的导电性及强度。
In this paper the effect of size of silver particles, proportion, curing agent and curing condition on epoxy resin - low - molecular polyamide - silver particles system are studied and discussed.
选用一种液体改性芳香胺为环氧树脂的固化剂，得到了一种适合于树脂传递模塑(rtm)的高性能树脂体系。
Through applying a liquid modified aromatic amine as curing agent for epoxy resin, a high performance resin matrix system for resin transfer moulding (RTM) was derived.
该理论可望推广至用固化剂固化的其它类型的热固性树脂体系。
It is expected that this theory can be extended to other thermosetting resin systems cured by hardener.
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