对一种先进的双悬臂梁高量程MEMS加速度计的单芯片封装工艺进行了失效机理分析。
Failure analysis is conducted for the single chip packaging process of an advanced high-range MEMS accelerometer with double cantilever beams.
在钢筋混凝土双悬臂梁试验系统中，应变、挠度以及荷载是其主要的测试内容。
In test system of reinforced concrete double cantilever beams, strain, deflection and load were principal experimental contents.
报道一种利用双侧悬臂梁展宽光纤光栅带宽实现对挠度和应力线性传感的新方法。
A new linear sensing method of deflection and stress, in which the fiber grating bandwidth is stretched by using bilateral cantilever beam, is reported.
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