进板25PCB正在被推出料架， 推向印刷机自动推杆 印刷锡膏(Solder Paste Printing)-126钢网（stencil) 印刷锡膏(Solder Paste Printing)-227 印刷示意图刮刀SolderSolder PrinterPrinter内部工作内部工作示示意图...
基于8个网页-相关网页
建构了电路板锡膏的三维测量系统，实现了印刷锡膏均匀性参数的获取，从而达到对表面贴装质量进行监控和评价的目的。
The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology (SMT) product line.
表面贴装，钢网是锡膏准确重复印刷的关键。
In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.
本文简述了锡膏印刷的工艺流程，分析印刷过程中造成的相关缺陷及其产生的原因，并提出了相应的解决方法。
This article introduces the process of solder paste technical printing, analyses the interrelated disfigurement in printing and cause, and puts forward the relevant solvent.
应用推荐