... semiconductor storage unit 半导体存储器 semiconductor substrate 半导体衬底 semiconductor switch 半导体开关 ...
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... semiconductive ceramics 半导体陶瓷 semiconductive body 半导体衬底 semiconductive polymer 半导电聚合物 ...
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... semiconductor billet 半导体晶锭 semiconductor blank 半导体衬底 semiconductor bolometer 半导体辐射热测量器 ...
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semiconductor wafer,semiconductor wafer,半导体薄片 semiconductor substrate,semiconductor substrate,半导体衬底 semiconductor slice,semiconductor slice,半导体薄片 ..
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切割膜框架带、减薄的半导体衬底和C4研磨带的组件。
The assembly of the film frame tape, the thinned semiconductor substrate, and the C4 grind tape is diced.
在半导体衬底的正面形成C4研磨带和激光烧蚀粘合层。
A C4 grind tape and a laser-ablative adhesive layer are formed on a front side of a semiconductor substrate.
实施例中,本方法包括在半导体衬底上形成栅极电介质层。
In an embodiment, the method includes forming a gate dielectric layer on a semiconductor substrate.
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