XX节所描述的内部总线通过一组位于微处理器集成电路内的总线缓冲器与外部总线连接。
The internal processor bus described in Sec. XX is connected to the external processor bus by a set of bus buffers located on the microprocessor integrated circuit.
塑封集成电路因其是非气密性封装，封装材料热膨胀系数的不同以及被粘接材料表面能低，是造成塑封电路离层或开裂的内部原因。
First of all, the internal reason for the delamination or cracking is the different CTE of the packaging materials and the low surface energy of the adhesions.
这种新型的硅基发光管结构在下一代集成电路中作为芯片之间或芯片内部的光互连具有非常广阔的应用前景。
The new type silicon-based luminous tube structure has a widely application prospect as light connection between chips or chips inner in next generation integrated circuit.
应用推荐