CTP 4中支持的模型探测 约定有：主键、关系反转、外键及多元化的表名
Model discovery conventions supported in CTP 4 are: Primary Key, Relationship Inverse, Foreign Key, Pluralization of Table Names
在反转法的原理上，建立了硅片自旋转磨削材料去除率的理论模型，推导了材料去除率公式，分析了磨削工艺参数与材料去除率的关系。
By the principle of reversal process, the formula of material removal rate (MRR) in wafer rotation grinding process is deduced. The relationship between MRR and the grinding parameters is given.
本文运用KA模型研究了铁电薄膜的电畴反转特性与外加电场强度以及温度的关系。
The dependence of domain reversal characteristics of the ferroelectric thin film on external electric field and temperature is investigated by using the KA model.
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