... 倒装芯片集成电路 face down integrated circuit ; flipchipintegratedcircuit 板上倒装芯片 FCOB 倒装芯片贴装 flip chip attach ...
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集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅；
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
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