... 大陆块 continental plates (geology) 倒装芯片封装 flip chip packaging 地块大小 parcel size ...
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集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅；
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
板上倒装芯片(FCOB)作为一种微电子封装结构形式得到了广泛的应用。
Flip Chip on Board (FCOB) has been used widely as a microelectronics packaging structural form.
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