高速ASIC封装的电性能参数包括传输延迟、特性阻抗、信号串扰以及封装电感和电容等。

The electric characteristic parameters of package for high speed ASIC include propagation delay, characteristic impedance, cross talk, parasitic inductance and capacitance.

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最后，从抗频偏的角度出发，通过分析2fsk信号的延迟相关特性，给出了一种码元同步算法，具有良好的抗频偏性能。

At last, this paper analyses the delay correlation properties of 2fsk signal, and proposes a new algorithm for symbol synchronization, which shows better performance when frequency offset exists.

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利用频谱相除技术构建了延迟时间测量的信号模型，研究了频谱相除后信号的幅频特性。

The spectrum division technique was used for establishing signal model of delay time measurement, and amplitude frequency characteristics of the signal after spectrum division was investigated.

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