由不胀钢制成非常低膨胀系数的样品载台保证温度变化对样品的位置没有影响。

A very low linear expansion coefficient sample carrier made from invar ensures that temperature change has no effect on the sample position.

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塑封集成电路因其是非气密性封装，封装材料热膨胀系数的不同以及被粘接材料表面能低，是造成塑封电路离层或开裂的内部原因。

First of all, the internal reason for the delamination or cracking is the different CTE of the packaging materials and the low surface energy of the adhesions.

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采用铅硼硅熔决釉研制出同时符合普通粘土瓦坯的烧成温度低、热膨胀系数低这两个主要性能特点的釉料。

The color glaze of low firing temperature and low expansion coefficient, to match the glaze tile made from common clay, was prepared in lead borosilicate system.

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