详述了上位机软件的功能、模块及数据的组织，分析了主程序流程和与下位机通信的流程。
The software function, modules and data organization of the Upper Layer Computer are explained, the process of main program and that of the communication with Upper Layer Computer are narrated.
硬件部分包括测试电路、无线收发和上位机通信，并编制了相应的软件程序。
Hardware includes the test circuit, wireless transceiver and host computer communications; we also developed corresponding software programs.
介绍了伦茨变频器通过LECOM协议与上位机通信的方法。给出了LECOM通信的硬件构成、通信协议以及程序设计方法。
A method of LECOM communication of LENZE inverter to the host is described, and the hardware composition, communication protocol and programming design method are also presented.
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