然后基于实验研究，并结合三维全波电磁仿真软件在频域和时域对通孔结构性能进行分析。

And then, based on experiments and combined with three-dimensional full-wave electromagnetic simulation software, the frequency domain and time domain performance of the through-hole via is analyzed.

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利用商用三维电磁场分析软件HFSS对集成化低噪声放大器组装和互连中的关键参数进行了仿真和优化。

Some critical parameters of packaging and interconnection of the integrated LNA were simulated and optimized by using commercial 3d electromagnetic field analysis software HFSS.

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为了使系统获得更高的图像分辨率，通过电磁场有限元仿真软件COMSOL分析，构建ERT/ECT双模态敏感阵列电极三维模型。

In order to improve the image resolution of the system, a 3D model of ERT/ ECT dual-modality sensing electrode array was established by using the software COMSOL.

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