两种模型的仿真结果与工艺试验结果比较表明，双椭球形热源模型比高斯热源模型更适合双丝焊的三维有限元分析。

The comparisons between the simulated results of two models and experiments show that double ellipsoidal model is better than Gaussian model on three-dimensional analysis.

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该文利用有限元法对电容式角位移传感器三维电场进行分析，仿真研究不同结构参数的敏感元件，所得结论与实验结果吻合。

Electric field of capacitive angular sensor are analyzed by finite element methodology. Sensors with different dimensions are studied by simulation. The result is proved by the experiment.

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此外，利用有限元ansys软件对PC B组件在整个红外再流焊炉中的焊接过程建立了实体模型，进行了PC B组件再流焊全过程的三维动态模拟和仿真。

Furthermore, the soldering process of PCBA in the whole infrared reflow soldering stove is modeled by the finite element software, ANSYS, and is simulated by the three-dimensional modelling.

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