概述了陶瓷-金属焊接的特点。
Characteristics of joining ceramics to metals by welding are summed up.
利用声学扫描检测技术，提示了热烧毁的微波功率器件氧化铍陶瓷基片与底座金属散热片的焊接不良现象；
Burn-out of a microwave power device due to the poor bonding between beryllium oxide and base metal sink was investigated using Sound Scanning technique.
为提高陶瓷金属化层的焊接性能，提出了一种陶瓷二次金属化镀镍工艺。
In view of the poor solderability of metallic film formed on ceramic surface, a secondary metallization of ceramic surface by nickel plating was advanced.
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