介绍了一种焦磷酸盐镀铜溶液中铜、总焦磷酸根、磷酸根、柠檬酸铵含量的分析方法和计算方法。
An analytical procedure and calculation method on the content of copper, total pyrophosphate, phosphate and ammonium citrate in pyrophosphate copper plating bath were given.
本文采用镀铜铂电极和暂态恒电流阶跃的方法测得了铜物显（铜物理显影）体系的极化曲线。
The polarization curves of copper physical development (CuPD) system were obtained by transient constant current step method on copper plated platinum electrode.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
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