IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
Japanese electronics firms all have operations in China, for example, but mostly for low-end assembly work rather than high-end production.
日本电子公司全部都在中国有业务,例如,大部分的业务都是低端的装配工作而不是高端的生产。
On the basis of customers' stature characters, assimilating design concept and research results of a lot of foreign high-end production, we create high-end titanium bicycle frames.
通过不断引进很多国外高端自行车产品的设计理念和研究结果,并根据消费者的身材特点研发出高端的钛合金运动自行车车架。
应用推荐