The two trends in the electronics packaging component field nowadays are the miniaturization in the size and high intensity in power.
尺寸小型化与功率高密度化是当今电子封装器件两大主要发展趋势。
Similar rated drive electronics will more than likely have the same size devices.
类似的评价驱动电子将超过可能具有相同的大小设备。
WOW for Small Speakers: Most of today's consumer electronics and wireless devices are getting smaller in size, however the audio capabilities are becoming more robust.
WOW对小型扬声器的意义:现在大多数消费电子产品和无线设备都变得越来越小,但音频能力却受到了限制。
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