The two trends in the electronics packaging component field nowadays are the miniaturization in the size and high intensity in power.
尺寸小型化与功率高密度化是当今电子封装器件两大主要发展趋势。
One big advantage of plastic electronics is that there is virtually no restriction on size.
一个大的优势,塑料电子学是,有几乎没有任何限制大小。
Similar rated drive electronics will more than likely have the same size devices.
类似的评价驱动电子将超过可能具有相同的大小设备。
应用推荐