电子组件(Electronics Package)用于处理打印头的控制信号,调节电压并驱动压电激励器。它包括两个完全相同的电子板件,分别用于上部和下部的64喷嘴阵列。
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electronics package material 电子封装材料
electronics package conversion 电子转换
Introduction to Electronics Package 电子封装概论
Electronics Upgrade Package 测厚仪电器升级包
Their working model is a shoebox-sized package of electronics and liquid-filled tubes, with a silicon chip at its core.
他们的工作模型是一个鞋盒大小的电子盒和一个填满液体的管道,这个模型的核心是一块硅片。
Samsung Electronics announced that it has developed the industry's first thermally-enhanced chip-on-film (TECOF) package for the display driver IC (DDI) used in large-screen, high-resolution LCD TVs.
三星电子最近宣布,他们发明出了工业界第一个TECOF装置,这能用于大屏幕、高分辨率的LCD电视中的显示器驱动器集成电路(DDI)。
More often, the micromachined part and electronics are fabricated separately and then wire bonded together in a single package.
通常,显微机械加工的部件和电子电路是分开制造的,然后在同一封装块内用线将它们连在一起。
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