The microelectronic packaging technology is an important technology that affects performance, size, price and reliability of final electronic products.
微电子封装技术是一项重要的技术，这项技术直接影响最终电子产品的性能、外形尺寸、价格及可靠性能。
He has extensive experience in the fields of semiconductor and electronic packaging, electronic manufacturing, surface finishes and coatings, failure mode analysis and reliability assessment. Dr.
在半导体电子封装，电子制造，表面镀层及涂覆，失效模式分析和可靠性评估方面具有丰富经验。
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