...电子封装材料；Al2O3陶瓷；AlN陶瓷；BeO陶瓷；SiC陶瓷；Si3N4陶瓷；流延成型；凝胶注模成型[gap=954]Key words: electronic packaging materials; alumina ceramics; AlN ceramics; beryllium ceramics; silicon carbide ceramics; ..
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The Preparation and Property Research of Epoxy Resin Based Electric Electronic Packaging Material;
研究了玻璃粉／环氧树脂封接复合材料的制备与性能。
The invention relates to polyphenyl methylsiloxane modified epoxy resin and a manufacturing method of an electronic packaging material thereof.
本发明涉及聚苯基甲基乙氧基硅烷改性环氧树脂及其电子封装材料的制 法。
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