A method for fabricating an electronic element is also provided.
还提出了一种制造电子元件的方法。
The electronic element comprises a substrate, and a first electrode layer arranged on the substrate.
该电 子元件包括基板,第一电极层设置于基板上。
It can be used for electroless tin plating on copper substrate in electronic element, surface mounting device and PCB.
结果表明 :该工艺镀液稳定 ,可用于电子元器件以及表面安装器件、印制电路板等铜基上化学镀锡。
应用推荐