Therefore, electroplating of lead-free solder coating is one of investigation hotspots in electronic electroplating field.

因此，电沉积无铅可焊性镀层是电子电镀领域的研究热点之一。

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With the rapid development of electronic electroplating industry, there are increasingly stringent requirements on the quality of the claddings, especially on the weldability.

随着电子电镀工业的飞速发展，镀层质量的要求也越来越高，尤其是在可焊性方面更为突出。

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