Electronic Beam Curing 电子束硬化技术
This article presents radiation curing technology progress and applications on electronic information industry.
叙述了辐射固化技术在电子信息工业中的应用和在该领域的技术进展。
Low viscosity reactive casting resin. Recommended with amine and polyaminoamide curing agents for low voltage electrical and electronic applications.
低粘度浇铸树脂，建议与胺类和聚肽胺类固化剂组合用于低压电器。
An electronic component sealed or adhesively bonded with use of a cured body obtained by curing the aforementioned composition provides high reliability.
采用通过固化上述组合物获得的固化体密封或粘合剂粘接的电子元件提供了高的可靠性。
应用推荐