Then, package structure, especially the signal transmitting path structure is optimized using 3d electromagnetic simulation and microwave circuit theory. Effect of package lid is also studied.
然后通过三维电磁场仿真，并结合微波电路理论对封装结构，特别是高频信号传输路径进行了优化设计，另外对盖板的效应进行了定性分析。
Our industry leading electromagnetic field, circuit, systems and multiphysics simulation software fully automates the design process so you can better understand how your products behave.
我们行业领先的电磁场、电路、系统和多物理仿真软件能够将设计过程完全实现自动化，便于您更好地理解您产品的表现。
Engineers use the tools to conduct 3-D electromagnetic simulations and RF circuit simulation for antenna, GPS, and various wireless design applications.
工程师可以使用工具来进行天线，全球定位系统，以及各种无线应用的3 - D电磁模拟和RF电路仿真。
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