A self-limiting electroless plating process is provided to plate thin films with improved uniformity.
本发明提供一种自限制化学镀方法，以镀具有改进的均匀性的 膜。
The fiber is firstly coated with a thin copper or nickel plate with electroless plating method. Then, a thicker nickel plate is coated on the surface of the conductive layer.
提供了保护过程的技术细节，首先在光纤表面进行化学镀处理获得导电的薄镍层或铜层，然后在该导电层上进行电镀镍。
The electroless nickel planting had application very widely for its corrosion -resistant and fretting-resistant and homogeneous nickel-plate.
以次磷酸盐为还原剂的化学镀镍因具有优良的耐蚀性、耐磨性和镀层厚度均匀性而得到广泛应用。
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