electroless Cu plating 化学镀cu
Electroless Cu coating 非水体系镀铜
electroless cu deposition 化学镀铜
electroless Cu-Ag plating 化学镀铜银
regional electroless Cu-plating 局部化学镀铜
electroless Ni-Cu-P plating 化学镀Ni
electroless Ni-Cu-P alloy plating 化学镀Ni
electroless plated cu 化学镀cu
electroless plating cu 化学镀cu
Process specifications were discussed. The affecting factors on electroless Cu plating were briefly introduced.
讨论了常温化学镀铜与着色处理的工艺规范，简单介绍了化学镀铜的影响因素。
Factors affecting stability and deposition rate of electroless Cu are investigated and proper formulation and process for electroless Cu bath determined.
研究了影响化学镀铜镀速和镀液稳定性的诸因素，并根据实验确定了适宜的化学镀铜液配方及其工艺。
Satisfactory colored-films on iron craftworks were obtained by coloring process of electroless Cu plating at room temperature and chemical coloring in turn.
通过对铜原子结构的分析，提出了得到良好结合力的化学镀铜层的可能性，进而给出了使用“考本”液在钢铁上直接化学镀铜的工艺。
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