The chemical is widely used in the production of LSI, VLSI and other semiconductors to remove photoresist edge bead that occurs during typical spin coat wafer processing.

该试剂用于清除匀胶后残留于硅片边缘及背面的光刻胶，已经广泛应用于中、大规模集成电路及其它半导体器件的生产。

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This series of bead edge machine equipment is used for the sewing of decorative hand stitch on the fabric products.

此系列珠边机设备用于布料产品上装饰性手工线迹的缝制。

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The design of auto-body forming process commonly includes edge un-wrapping, choice of drawing direction, roughcast reckoning, design of addendum, adding the binder surface and setting the draw bead.

覆盖件拉延工艺的设计一般包括以下内容：翻边展开、拉深方向选择、坯料估算、工艺补充面的搭建、压料面的添加以及拉深筋的布置等等。

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